Global SemiFab Solutions  
"Customer Focused Productivity"


Global Solution for die or die strip Production: FilmFrame handles strips and film frames

The ability to accurately test "known-good die", test wafer-level packages and test micro-electromechanical systems (MEMS) after dicing is required to verify device quality. FilmFrame is an advanced film frame handling system that enables chipmakers to maximize efficiency, yield and profit in this area by providing full automation for this substrate handling.

FilmFrame Key Features and Benefits:

THE RESULTS: Safe testing of die and chip scale packaging.


For more information on the GSS filmframe, please contact: